SEAVO HB03
Last Updated: October 30, 2025
The SEAVO Embedded Computer HB03 addresses the critical challenges of high-performance AI computing in constrained robotic environments. Its pioneering modular architecture combines Intel® Core™ Ultra Series 2 processors (with integrated NPU and iGPU, up to 96 TOPS) and expandable MXM GPU support (Intel® Arc™ B570, total 300 TOPS), enabling robotics for complex tasks like large language models, vision recognition, and motion control. HB03 has dual-size designs (150×142×53mm/78mm) and thin/thick versions, which is suitable for various forms of robots. With wide-voltage input (12V/48V), ruggedized I/O, and dual-fan cooling, it also ensures high reliability in dynamic scenarios. The SEAVO Embedded Computer HB03 integrates CPU and GPU/NPU on a single motherboard, solves computing power bottlenecks and system redundancy, and enables large-scale practical application of embodied intelligence with strong performance, compact size, and high cost-effectiveness.
- SEAVO HB03
- Modular Design
- Compact Form Factor
- Powerful AI Computing Capabilities
- High Reliability
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