Webinars

The medical imaging market is undergoing a profound transformation, driven by the rapid integration of AI into diagnostic devices. Ultrasound and X-ray systems increasingly demand higher performance, lower latency, and enhanced energy efficiency in order to deliver real-time image processing, AI-assisted diagnostics, and mobile point-of-care operation.

At the same time, manufacturers face pervasive challenges:

• Rising complexity of integrating CPU, GPU, and AI accelerators.
• Need for compact, energy-efficient designs for portable diagnostic devices.
• Long product life cycles with strict regulatory and certification requirements.

congatec addresses these pain points with its COM Express Type 6 conga-TC750 and COM-HPC Client modules, powered by Intel® Core™ Ultra processors (Series 2). These modules combine heterogeneous compute (CPU + GPU + NPU) in a compact footprint, delivering up to 99 TOPS AI performance while minimizing thermal output. The result is a scalable, field-upgradable platform that enables AI-enhanced ultrasound and X-ray machines with superior efficiency and reliability.

Developers benefit from congatec’s aReady software stack with built-in virtualization, security (OPNsense firewall), and AI toolkits such as Intel® OpenVINO™. This reduces time-to-market and allows faster deployment of AI-enabled medical imaging solutions.

This session will first explore the market landscape of AI in medical imaging, highlighting industry pain points and competitive trends. It will then dive into the technical capabilities of congatec’s COM modules, showing how Intel’s heterogeneous compute architecture (CPU, GPU, NPU) is leveraged for real-world medical imaging workloads. Finally, the session will present deployment insights and success stories from OEM adoption in medical devices, underlining how congatec empowers innovation in healthcare diagnostics.