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Showing 1-10 of 155 results for "energy"
Displaying Solution(s) For: All Categories
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NEXCOM International Co., Ltd. NEXCOM NDiS B362 Series

NEXCOM NDiS B362 Series

Length: Pages
Contributed by: NEXCOM International Co., Ltd. | Last Updated: February 10, 2026

The NDiS B362 is NEXCOM’s first IPC to feature an integrated NPU, delivering robust edge AI capabilities independent of network connectivity, and, powered by Intel® Core™ Ultra processors (Series 1). By optimizing workloads across the CPU, GPU, and NPU, it achieves up to 22.4 TOPS of AI computing power while maintaining superior energy efficiency. Built for durability, the system utilizes industrial-grade components rated for extreme temperatures (-20°C to 60°C). Dual HDMI 2.0... Read more

Product Brief Intel-Enabled AI Edge Tower-Rack Convertible Delivers High Performance Across Enterprise, Industrial, Medical, and Traffic Scenarios

Intel-Enabled AI Edge Tower-Rack Convertible Delivers High Performance Across Enterprise, Industrial, Medical, and Traffic Scenarios

Length: 2 Pages
Contributed by: Intel Corporation,Shenzhen Decenta Technology Co., LTD | Last Updated: January 22, 2026

Most companies struggle to process large amounts of data efficiently and adapt to different cases, causing delays and high costs due to varied development needs and AI compute limits. Decenta AI Tower-Swap All-in-One Machine built on the Intel ® Q870 chipset, Supports Intel® Core ™ Ultra processor, delivering strong computing performance. Energy-efficiency optimization ensures ultra-fast realtime decision-making in edge computing scenarios.

Dell EMC Dell PowerEdge R770 Rack Server

Dell PowerEdge R770 Rack Server

Length: Pages
Contributed by: Dell EMC | Last Updated: January 21, 2026

The Dell PowerEdge R770 is a 2U, two-socket rack server delivering exceptional performance and scalability transforming complex IT requirements of today’s data centers. It combines enhanced compute power, flexible configurations, and energy efficiency to boost productivity. This makes it ideal for virtualization and microservices, cloud-native applications, large-scale analytics, and AI inferencing support to empower your infrastructure. Powered by Intel® Xeon® 6 processors... Read more

Hongdafong HDF AIS-MTLD5P

Hongdafong HDF AIS-MTLD5P

Length: Pages
Contributed by: Hongdafong | Last Updated: January 13, 2026

Hongdafong HDF AIS-MTLD5P is a high-performance, rack-mounted AI PC designed for demanding workloads such as AI inference, data analytics, and edge computing. Built for scalability and flexibility, it delivers exceptional computing power while maintaining energy efficiency. Powered by the Intel® Core™ Ultra 5 Processor 135H, it combines hybrid-core architecture with integrated Intel® Arc™ graphics and an onboard NPU for up to 18 TOPS (Int8) AI acceleration. The system features... Read more

Product Brief Decenta S25-ARLS-WA02 : Intel-enabled AI edge tower-rack convertible delivers high performance

Decenta S25-ARLS-WA02 : Intel-enabled AI edge tower-rack convertible delivers high performance

Length: 2 Pages
Contributed by: Intel Corporation,Shenzhen Decenta Technology Co., LTD | Last Updated: January 13, 2026

Most companies struggle to process large amounts of data efficiently and adapt to different cases, causing delays and high costs due to varied development needs and AI compute limits. Decenta AI Tower-Swap All-in-One Machine built on the Intel ® Q870 chipset, Supports Intel® Core ™ Ultra processor, delivering strong computing performance. Energy-efficiency optimization ensures ultra-fast realtime decision-making in edge computing scenarios.

Decenta S25-ARLS-WA02

Decenta S25-ARLS-WA02

Length: Pages
Contributed by: Decenta | Last Updated: January 13, 2026

Most companies struggle to process large amounts of data efficiently and adapt to different cases, causing delays and high costs due to varied development needs and AI compute limits. Decenta AI Tower-Swap All-in-One Machine built on the Intel® Q870 chipset, supports Intel® Core™ Ultra processor, delivering strong computing performance. Energy-efficiency optimization ensures ultra-fast real-time decision-making in edge computing scenarios. Supports two PCIe 5.0 x16 slots (supports... Read more

Product Brief High-Performance 2U Rack Server with Optimal Power Efficiency

High-Performance 2U Rack Server with Optimal Power Efficiency

Length: 2 Pages
Contributed by: Intel Corporation, Dell EMC | Last Updated: January 13, 2026

The Dell PowerEdge R770 is a 2U, two-socket rack server delivering exceptional performance and scalability transforming complex IT requirements of today's data centers. It combines enhanced compute power, flexible configurations, and energy efficiency to boost productivity.

Product Brief Hongdafong HDF AIS-MTLD5P: High-Performance Rack-Mounted AI PC for Demanding Workloads

Hongdafong HDF AIS-MTLD5P: High-Performance Rack-Mounted AI PC for Demanding Workloads

Length: 2 Pages
Contributed by: Intel Corporation | Last Updated: January 13, 2026

Hongdafong HDF AIS-MTLD5P is a high-performance, rackmounted AI PC designed for demanding workloads such as AI inference, data analytics, and edge computing. Built for scalability and flexibility, it delivers exceptional computing power while maintaining energy efficiency.

Case study Modernizing and Automating Sustainable Manufacturing at Scale

Modernizing and Automating Sustainable Manufacturing at Scale

Length: 3 Pages
Contributed by: Intel Corporation | Last Updated: January 09, 2026

Pou Chen Group (PCG)—the world’s largest branded athletic and casual footwear manufacturer and ranked a Top 3 “Best ESG” company for institutional investors—is committed to improving footwear manufacturing systems so that they positively contribute to a more sustainable world. Taking 2019 as the base year, the group aims to achieve “zero growth” in greenhouse gas emissions by 2025 and targets a 46.2% reduction by 2030.

White Paper Industrial and Robotics Innovation with Intel® Core™ Ultra Processors (Series 3)

Industrial and Robotics Innovation with Intel® Core™ Ultra Processors (Series 3)

Length: 3 Pages
Contributed by: Intel Corporation | Last Updated: January 08, 2026

Explore how Intel® Core™ Ultra processors (Series 3) power next-generation industrial and robotics solutions at the edge. This white paper dives into hybrid AI acceleration (CPU/GPU/NPU), real-time performance with Intel® TCC, and streamlined functional safety for rugged environments. From industrial controllers and robotics to automation, test systems, and energy distribution, discover how these processors deliver high-throughput, low-latency computing for mixed-criticality... Read more

Showing 1-10 of 155 results
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