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The DFI EC70A-MTH solves factory automation and AMR challenges by packing Intel® Core™ Ultra processor performance into a compact, fanless, and rugged system. It delivers advanced AI inference via built-in Intel® Arc™ graphics, eliminating the need for bulky discrete GPUs.

Pou Chen Group (PCG)—the world’s largest branded athletic and casual footwear manufacturer and ranked a Top 3 “Best ESG” company for institutional investors—is committed to improving footwear manufacturing systems so that they positively contribute to a more sustainable world. Taking 2019 as the base year, the group aims to achieve “zero growth” in greenhouse gas emissions by 2025 and targets a 46.2% reduction by 2030.

Explore how Intel® Core™ Ultra processors (Series 3) power next-generation industrial and robotics solutions at the edge. This white paper dives into hybrid AI acceleration (CPU/GPU/NPU), real-time performance with Intel® TCC, and streamlined functional safety for rugged environments. From industrial controllers and robotics to automation, test systems, and energy distribution, discover how these processors deliver high-throughput, low-latency computing for mixed-criticality workloads with extended reliability and long-life availability.

Intel is driving the next era of smart manufacturing with AI, real-time insights, and software-defined automation. At the core is SDIAS—a modular, open, AI-ready architecture that unifies IT and OT, enabling faster, smarter, and scalable factories.

The NODKA IPC-615H5-Q670 is a 4U rackmount industrial computer powered by 12th–14th Gen Intel® Core™ processors,delivering up to 125 W TDP to meet the demands of modern AI and edge inference workloads. Designed for compute-intensive industrial environments, it supports dual Intel® Arc™ A770 GPUs via two PCIe 4.0 x16 slots, enabling GPU-accelerated performance for machine vision, analytics, and automation. With dual-channel DDR5-4800/5600 MHz SO-DIMMs supporting up to 64 GB of memory, and multiple PCIe and legacy expansion slots, the NODKA IPC-615H5-Q670 offers exceptional scalability, I/O bandwidth, and parallel processing capability, delivering the computing power required for real-time AI processing and high-throughput industrial applications at the edge.

BCO‑3000‑RPL is a semi‑rugged, small‑form‑factor industrial edge PC designed for space‑constrained deployments and real‑time IoT and AI workloads. Powered by 12th/13th Gen Intel® Core™ processors (35 W) with hybrid P‑ and E‑core architecture, it delivers socket‑type performance in a compact footprint. The system supports up to 64 GB DDR4 memory, triple independent display outputs (2× DP, 1× HDMI), and rich IIoT‑centric connectivity including 3× 2.5 GbE LAN, multiple COM ports, and high‑speed USB 3.2 interfaces.

BCO‑500‑MTL is a high‑performance, semi‑rugged fanless mini industrial PC purpose‑built for edge AI and automation workloads. Powered by Intel® Core™ Ultra 5 (125U) or Intel® Core™ Ultra 7 (155U) processors with integrated Intel® AI Boost NPU, it delivers advanced AI inferencing and energy‑efficient computing in a compact footprint. The system supports up to 32 GB DDR5 memory and features triple 2.5 GbE LAN, dual DisplayPort, and USB‑C for versatile connectivity.

PSA6000 solves a critical industry challenge: delivering advanced performance and security at an affordable price. PSA6000 meets this need by combining 13th Gen Intel® Core™ i5 processor with a multi-touch Full HD display, ensuring smooth operation for complex automation tasks. PSA6000 runs on Windows 11 IoT Enterprise LTSC, ensuring long-term stability for industrial applications. It integrates advanced security features such as TPM and BitLocker and complies with IEC62443 standards, providing robust protection against cyber threats.

Harmony PSA6 Panel PC solves a critical industry challenge: delivering advanced performance and security at an affordable price. PSA6 meets this need by combining 13th Gen Intel® Core™ i5 processor with a multi-touch Full HD display, ensuring smooth operation for complex automation tasks. Harmony PSA6 runs on Windows 11 IoT Enterprise LTSC, ensuring long-term stability for industrial applications. It integrates advanced security features such as TPM and BitLocker and complies with IEC62443 standards, providing robust protection against cyber threats.

DCO‑1000‑ASL is an ultra‑compact, DIN‑rail‑mounted fanless edge computer purpose‑built for industrial IoT and automation in space‑constrained environments. Powered by the Intel Atom® x7433RE processor (quad‑core, 9 W TDP) with blazing‑fast DDR5 memory, it delivers efficient performance for real‑time data processing at the edge. The system features 4× 2.5 GbE LAN ports with TSN support, dual 4K DisplayPort outputs, and a balanced I/O configuration including multiple USB 3.2 and serial ports for seamless sensor and device integration. Expansion options include M.2 slots for NVMe storage and wireless connectivity, while out‑of‑band management enables secure remote monitoring and recovery even when the OS is unresponsive.

VCO‑6000‑RPL‑3‑2PWR is a rugged, GPU‑optimized edge computer purpose‑built for high‑performance AI and machine vision workloads in harsh industrial environments. Powered by 12th/13th Gen Intel® Core™ processors (35W TDP, LGA 1700) with hybrid P‑ and E‑core architecture, it delivers exceptional compute efficiency for real‑time inference. The system supports up to 64 GB DDR5 memory and features dual full‑height, full‑length (FHFL) PCIe Gen 4 slots with a dedicated 600 W power budget for advanced GPU acceleration.

RCO‑6000‑RPL is a super‑rugged, fanless edge AI computer built for Industry 4.0 and mission‑critical deployments. Powered by 12th/13th Gen Intel® Core™ processors (LGA 1700, 35 W TDP) with hybrid P‑ and E‑core architecture, it delivers high‑performance computing in harsh environments from –25 °C to 70 °C. The system supports blazing‑fast DDR5 memory, triple independent displays, and modular EDGEBoost expansion for GPU acceleration, NVMe storage, and versatile I/O connectivity.